OSDZU3EG1-2G-HFA

CLASSIFICATION

Microcontrollers, Microprocessor, FPGA Modules

manufacturer

Octavo Systems LLC

type

SYSTEM-IN-PACKAGE: AMD ZYNQ ULTR

encapsulation

package

Tray

RoHS

YES

price

available options

price inquiry

inventory：1600

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specifications

Part Status

Active

Operating Temperature

-40°C ~ 105°C

Module/Board Type

MPU Core

Flash Size

128MB

RAM Size

2GB

Speed

500MHz, 1.2GHz

Core Processor

ARM® Cortex®-R5F, ARM® Quad Cortex®-A53

Connector Type

600-BGA

Size / Dimension

1.570" L x 0.807" W (40.00mm x 20.50mm)